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  www.gennum.com go1525 hd-linx?ii voltage controlled oscillator go1525 data sheet 21969 - 8 july 2005 1 of 9 key features ? generates 1.485ghz or 1.485/ 1.001ghz signal for hd-linx ? ii ics ? low current consumption ?50 output impedance ? operates from a single 2.5v supply ? 8 pin tape on reel ? pb-free and rohs compliant applications ? vco for the gs1560, gs1559 and gs9060 deserializers, and the gs1532, gs1531 and GS9062 serializers description the go1525 is a self cont ained, miniature voltage controlled oscillator (vco). it produces a clean 1.485ghz reference clock si gnal for the gs1560 and gs9060 deserializers, and for the gs1532 and GS9062 serializers. the cont rol voltage range is from 1.0 volts to 1.5 volts and is derived from the on-chip plls. the go1525 frequency can be pulled approximately 32mhz for every one volt of control. the output level is typically -9.0dbm with low spurious and noise content. it is designed to drive 50 strip lines. the vco requires a single 2.5v supply and draws a maximum of 15ma of current. it is packaged in a miniature 8-pin proprietary surface mount package and operates over the normal commercial temperature range of 0c to +70c. this component and all homogeneous subcomponents are rohs compliant. go1525 functional block diagram oscillator circuit stripline stripline v ctr v cc out gnd
go1525 data sheet 21969 - 8 july 2005 2 of 9 contents key features.................................................................................................................1 applications................................................................................................................... 1 description .................................................................................................................... 1 1. pin out ..................................................................................................................... .3 1.1 pin assignment ...............................................................................................3 1.2 pin descriptions ..............................................................................................3 2. electrical characteristics ...........................................................................................4 3. soldering recommendations ......................... ...........................................................5 3.1 reflow conditions ................................ ...........................................................6 3.2 soldering flux .................................................................................................6 3.3 rework or repair ............................................................................................6 3.4 endurance to warp ........................................................................................6 4. handling recommendations .... .............. .............. .............. .............. .............. ...........7 4.1 cleaning ..........................................................................................................7 4.2 storage ...........................................................................................................7 4.3 transport .........................................................................................................7 4.4 esd warning ..................................................................................................7 5. package & ordering information ...............................................................................8 5.1 package dimensions ......................................................................................8 5.2 packaging data ...............................................................................................8 5.3 ordering information ............................... ........................................................8 6. revision history ........................................................................................................9
go1525 data sheet 21969 - 8 july 2005 3 of 9 1. pin out 1.1 pin assignment 1.2 pin descriptions go1525 nc gnd o/p gnd gnd gnd v cc v ctr 321 4 8 57 6 note: pin numbers are arbitrary there are no pin markings on the device itself top view table 1-1: pin descriptions pin number name type description 2, 4, 6, 8 gnd power most negative power supply connections. 5v ctr input control voltage for the vco. 7v cc power most positive power supply connection. 1 o/p output vco signal output. 3 nc ? no connection. note: pin numbering different from go1515
go1525 data sheet 21969 - 8 july 2005 4 of 9 2. electrical characteristics table 2-1: electrical characteristics v cc = 2.5v 0.25v, temperature = 0c to 70c, unless otherwise shown parameter symbol conditions min typ max units notes supply voltage v cc ? 2.25 2.5 2.75 v supply voltage supply current s ? ? ? 15 ma supply current control voltage range v ctr ? 1.0 ? 1.5 v control voltage range control voltage sensitivity df/dv ? 25 32 39 mhz/v control voltage sensitivity operating frequency range ? vco vctr = 1.0v 1483.5 ? ? mhz operating frequency range vctr = 1.5v ? ? 1485.0 mhz output signal level v out ? -12 -9 -6 dbm output signal level pushing figure ? v cc = 2.5v 0.25v, ref: v cc = 2.5v ? 1.5 ? mhz pushing figure pulling figure ? vswr = 2.0 for all phase, ref: 50 ? 1.0 ? mhz pulling figure temperature stability t coef 0c to 70c, ref. = 25c ? ? 3 mhz temperature stability spurious response ? ? ? ? -10 dbc spurious response output impedance z o ??50? output impedance
go1525 data sheet 21969 - 8 july 2005 5 of 9 3. soldering recommendations the device is manufactured with matte-sn te rminations and is compatible with both standard eutectic and pb-free solder refl ow profiles. the recommended standard eutectic reflow profile is shown in figure 3-1 . the maximum recommended pb-free reflow profile is shown in figure 3-2 . figure 3-1: standard eutect ic solder reflow profile figure 3-2: maximum pb-free solder reflow profile 25?c 100?c 150?c 183?c 230?c 220?c time temperature 6 min. max 120 sec. max 60-150 sec. 10-20 sec. 3?c/sec max 6?c/sec max 25?c 150?c 200?c 217?c 260?c 250?c time temperature 8 min. max 60-180 sec. max 60-150 sec. 20-40 sec. 3?c/sec max 6?c/sec max
go1525 data sheet 21969 - 8 july 2005 6 of 9 3.1 reflow conditions the device will meet the data sheet specifications afte r completing the reflow process according to the profile shown in figure 3-1 or figure 3-2 . recommended soldering conditions are as follows: 3.2 soldering flux do not use cleaning type flux. washing th e devices after using cleaning type flux may damage inner parts and affect performance. 3.3 rework or repair rework or repair must only be done once. do not reflow the device more than twice; once for initial soldering an d once for remounting after rework. do not vibrate the vco during reflow soldering. 3.4 endurance to warp when the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the pcb is warped as shown in figure 3-2 , the device will not be cracked or damaged. figure 3-3: pcb warp preheating 15010c, 60 to 120 sec. soldering peak 260c over 200c within 30 sec. vco pcb max 2mm
go1525 data sheet 21969 - 8 july 2005 7 of 9 4. handling recommendations 4.1 cleaning there are two options fo r cleaning the devices. option 1: 1. clean but do not use solvent cleaners. 2. thoroughly dry assemblies afterwards. option 2: 1. mount device after board is cleaned. 4.2 storage store the devices out of direct sunlight, at a stable temperatur e and humidity. avoid extreme temperatures, high humidity and wide temperature fluctuations. condensation on the devices may result in reduced quality and lowered solderability. avoid dust, sea breezes and corrosive gases (cl 2 , nh 3 , so 2 , no x , etc.). use within 6 months after de livery. if the devices are stored for more than one year, solderability may be degraded. 4.3 transport package the devices for transportation to avoid mechanical vibration or shock. 4.4 esd warning avoid poor ground connections and elec trostatic discharge or induction in production.
go1525 data sheet 21969 - 8 july 2005 8 of 9 5. package & ordering information 5.1 package dimensions 5.2 packaging data 5.3 ordering information go1525 top view 2.2 0.1 4.2 0.1 5.8 0.2 2.00.1 7.60.2 all dimensions in millimetres nc gnd out v cc v ctr gnd gnd 2.0 max 0.80.15 1.30.1 1.30.1 1.10 2.20 3.40 4.30 all dimensions in millimetres recommended footprint for pcb layout gnd 0.7 0.15 0.7 0.15 0.8 0.15 2.20 2.00 2.30 3.40 1.40 parameter value package type 8l proprietary surface mount package drawing reference 21307 rev.0 pb-free and rohs compliant yes part number package temperature range pb-free rohs compliant go1525-ctae3 8-pin tape on reel 0c to 70c yes yes
caution electrostatic sensitive devices do not open packages or handle except at a static-free workstation gennum corporation mailing address: p.o. box 489, stn. a, burlington, ontario, canada l7r 3y3 shipping address: 970 fraser drive, burlington, ontario, canada l7l 5p5 tel. +1 (905) 632-2996 fax. +1 (905) 632-5946 gennum japan corporation shinjuku green tower building 27f, 6-14-1, nish i shinjuku, shinjuku-ku, tokyo, 160-0023 japan tel. +81 (03) 3349-5501, fax. +81 (03) 3349-5505 gennum uk limited 25 long garden walk, farnham, surrey, england gu9 7hx tel. +44 (0)1252 747 000 fax +44 (0)1252 726 523 gennum corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. the sale of the circuit or device described herein does not imply any patent license, and gennum makes no representation that the circuit or device is free from patent infringement. gennum and the g logo are registered trademarks of gennum corporation. ? copyright 2002 gennum corporation. all rights reserved. printed in canada. www.gennum.com go1525 data sheet 21969 - 8 july 2005 9 9 of 9 document identification data sheet the product is in production. gennum reserves the right to make changes to the product at any time wit hout notice to improve reliability, function or design, in order to provide the best product possible. 6. revision history version ecr date changes/modification 0 120395 january 2002 new document 1 125583 july 2002 update document from ain to data sheet. changed supply voltage range in electrical characteristics table. 2 127841 february 2003 more detailed information added to the soldering and handling recommendations sections. document reformatted. 3 133240 march 2004 corrected package dimensions and added new footprint. 4 133445 july 2004 added ?pb-free? bullet. added pb-free solder reflow profile. 5 134964 november 2004 adding pb-free and green ordering information. converting to new document template. adding packaging data information. adding solder reflow profile description. updating product cleaning information. 6 136564 april 2005 changed ?green? references to rohs compliant. 7 137164 june 2005 rephrased rohs compliance statement. 8 137624 july 2005 corrected packages list in ordering information on page 8. corrected description of pb-free profile in soldering recommendations on page 5


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